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XCM517 Series
600mA Synchronous Dual Output Step-Down DC/DC Converters
ETR2425-007
The XCM517 series is a multi combination module IC which comprises of two 600mA driver transistor built-in synchronous step-down DC/DC converter. The XCM517 series is available in an ultra small package USP-12B01 suited for space conscious applications. The XCM517 series is a group of synchronous-rectification type DC/DC converters with a built-in 0.42 P-channel driver transistor and 0.52 N-channel switching transistor, designed to allow the use of ceramic capacitors. The ICs enable a high efficiency, stable power supply with an output current of 600mA to be configured using only a coil and two capacitors connected externally. Operating voltage range is from 2.7V to 6.0V. With the built-in oscillator, either 1.2MHz or 3.0MHz can be selected for suiting to your particular application. As for operation mode, the XCM517xA / XCM517xB series are PWM control, the XCM517xC / XCM517xD series are automatic PWM/PFM switching control, allowing fast response, low ripple and high efficiency over the full range of loads (from light load to heavy load). The soft start and current control functions are internally optimized. During stand-by, all circuits are shutdown to reduce current consumption to as low as 1.0 A or less. With the built-in UVLO (Under Voltage Lock Out) function, the internal P-channel driver transistor is forced OFF when input voltage becomes 1.4V or lower.
GENERAL DESCRIPTION
APPLICATIONS
Mobile phones, Smart phones Bluetooth equipment Personal Device Assistances Portable games Digital still cameras, camcorders
FEATURES
P-ch Driver Transistor Built-In N-ch Driver Transistor Built-In Input Voltage Range High Efficiency Output Current Oscillation Frequency Maximum Duty Cycle Soft-Start Circuit Built-In Current Limiter Circuit Built-In Ceramic Capacitor Compatible Control Methods : ON resistance 0.42 : ON resistance 0.52 : 2.7V ~ 6.0V : 92% (TYP.) : 600mA : 1.2MHz, 3.0MHz (+15%) : 100% (Constant Current & Latching)
TYPICAL APPLICATION CIRCUIT
: PWM (XCM517xA / XCM517xB) PWM/PFM Auto (XCM517xC / XCM517xD) *Performance depends on external components and wiring on the PCB. Combination of voltage 1 ch 2ch XCM517xx01D 1.2V 1.8V XCM517xx02D 1.2V 3.3V XCM517xx03D 1.8V 3.3V XCM517xx06D 1.5V 1.8V XCM517xx07D 1.5V 3.3V
*The other combination of voltage is semi-custom.
* The dotted lines in the circuit indicates the connection using through-holes at the backside of the PC board VOUT1 AGND1 EN1 VIN2 PGND2 Lx2
1
VOUT AGND
Lx
12
Lx1 PGND1 VIN1 EN2 AGND2 VOUT2
XC9235/XC9236
2
PGND
11
3
CE
VIN
10
4
VIN
CE
9
XC9235/XC9236
5 8
6
Lx
VOUT
7
(TOP VIEW)
1/28
XCM517 Series
PIN CONFIGURATIOIN
LX112 PGND1 11 VIN1 10 EN2 9 AGND2 8 VOUT2 7 *2 *1 1 VOUT1 2 AGND1 3 EN1 4 VIN2 5 PGND2 6 Lx2
USP-12B01 (BOTTOM VIEW)
PIN ASSIGNMENT
PIN NUMBER USP-12B01 1 2 3 4 5 6 7 8 9 10 11 12 XCM517 VOUT1 AGND1 EN1 VIN2 PGND2 Lx2 VOUT2 AGND2 EN2 VIN1 PGND1 Lx1 PIN NAME XC9235/XC9236 VOUT AGND CE VIN PGND Lx XC9235/XC9236 VIN PGND Lx VOUT AGND CE FUNCTIONS DC/DC-1 Channel Block: Output Voltage sense DC/DC-1 Channel Block: Analog Ground DC/DC-1 Channel Block: ON/OFF Control DC/DC-2 Channel Block: Power Input DC/DC-2 Channel Block : Power Ground DC/DC-2 Channel Block : Switching DC/DC-2 Channel Block : Output Voltage sense DC/DC-2 Channel Block : Analog Ground DC/DC-2 Channel Block : ON/OFF Control DC/DC-1 Channel Block : Power Input DC/DC-1 Channel Block : Power Ground DC/DC-1 Channel Block : Switching
NOTE: * A dissipation pad on the reverse side of the package should be electrically isolated. *1: Electrical potential of the DC/DC 1 channels' dissipation pad should be VSS level. *2: Electrical potential of the DC/DC 2 channels' dissipation pad should be VSS level. Care must be taken for an electrical potential of each dissipation pad so as to enhance mounting strength and heat release when the pad needs to be connected to the circuit.
2/28
XCM517
Series
PRODUCT CLASSIFICATION
Ordering Information
XCM517
DESIGNATOR DESCRIPTION Control, Oscillation Frequency and Options Output Voltage Package Device Orientation SYMBOL D R : See the chart below : Internally set sequential number relating to output voltage (See the chart below) : USP-12B01 : Embossed tape, standard feed DESCRIPTION
DESIGNATOR
CONTROL AA AB AC AD BA BB BC BD PWM Control PWM Control PWM/PFM Auto PWM/PFM Auto PWM Control PWM Control PWM/PFM Auto PWM/PFM Auto OCSILLATION FREQUENCY 1.2M 3.0M 1.2M 3.0M 1.2M 3.0M 1.2M 3.0M CL DISCHARGE Not Available Not Available Not Available Not Available Available Available Available Available HIGH SPEED SOFT-START Not Available Not Available Not Available Not Available Available Available Available Available EN INPUT LOGIC High Active High Active High Active High Active High Active High Active High Active High Active
DESIGNATOR
VOUT1 01 02 03 06 07 1.2 1.2 1.8 1.5 1.5
Output Voltage
VOUT2 1.8 3.3 3.3 1.8 3.3
*This series are semi-custom products.
For other combinations, output voltages and etc., please ask Torex sales contacts.
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XCM517 Series
BLOCK DIAGRAMS
XC9235A / XC9236A Series XC9235B / XC9236B Series Available with CL Discharge, High Speed Soft-Start
Phase Compensation
VOUT
R2 Error Amp.
PWM Comparator
Current Feedback Current Limit
Phase Compensation
VOUT
R2 Error Amp.
PWM Comparator
Current Feedback Current Limit
Logic
R1
Synch Buffer Drive
Lx VIN
Logic
R1
VSHORT
Synch Buffer Drive
Lx
VIN
Vref with Soft Start, CE
VSHORT
PWM/PFM Selector
Vref with Soft Start, CE
PWM/PFM Selector
CE/
Ramp Wave Generator OSC UVLO Cmp UVLO Ramp Wave Generator OSC
UVLO Cmp UVLO
VSS
R3
VSS
CE/MODE Control Logic
R3
R4
CE
R4
CE/MODE Control Logic
CE
NOTE: The signal from CE/MODE Control Logic to PWM/PFM Selector is being fixed to "L" level inside, and XC9235 series chooses only PWM control. The signal from CE/MODE Control Logic to PWM/PFM Selector is being fixed to "H" level inside, and XC9236 series chooses only PWM/PFM automatic switching control. Diodes inside the circuit are ESD protection diodes and parasitic diodes.
*Diodes inside the circuit are an ESD protection diode and a parasitic diode.
MAXIMUM ABSOLUTE RATINGS
PARAMETER VIN1 / VIN2 Voltage Lx1 / Lx2 Voltage VOUT1 / VOUT2 Voltage EN1 / EN2 Voltage Lx1 / Lx2 Current Power Dissipation (Ta=25 ) USP-12B01 Junction Temperature Operating Temperature Range Storage Temperature Range SYMBOL VIN1 / VIN2 VLx1 / VLx2 VOUT1 / VOUT2 VEN1 / VEN2 ILx1 / ILx2 Pd Tj Topr Tstg - 40 - 55 - 0.3 RATINGS - 0.3 6.5 VIN1 + 0.3 or 6.5 - 0.3 6.5 - 0.3 6.5 1500 150 125 + 85 + 125 UNITS V V V V mA mW
4/28
XCM517
Series
ELECTRICAL CHARACTERISTICS
XCM517Ax, 1ch Block /2ch Block
PARAMETER Output Voltage Operating Voltage Range Maximum Output Current UVLO Voltage Supply Current Stand-by Current Oscillation Frequency PFM Switching Current Maximum IPFM Limit Maximum Duty Ratio Minimum Duty Ratio Efficiency
(*2)
VOUT=1.8V, fOSC=1.2MHz, Ta=25
CONDITIONS When connected to external components, VIN=VEN=5.0V, IOUT1=30mA When connected to external components, (*8) VIN=VOUT(E)+2.0V, VEN=1.0V VEN=VIN,VOUT=0V, (*1, *10) Voltage which Lx pin holding "L" level VIN=VEN=5.0V, VOUT=VOUT(E)x1.1V VIN=5.0V, VEN=0V, VOUT=VOUT(E)x1.1V When connected to external components, VIN=VOUT(E)+2.0V,VEN=1.0V, IOUT=100mA When connected to external components, (*11) VIN=VOUT(E)+2.0V, VEN=VIN , IOUT=1mA VEN=VIN=(C-1) IOUT=1mA
(*11)
SYMBOL VOUT VIN IOUTMAX VUVLO IDD ISTB fOSC IPFM MAX IPFM MAXDTY MINDTY EFFI
MIN. 1.764 2.7 600 1.00 1020 120
TYP. 1.800 1.40 22 15 0 1200 160 200
MAX. 1.836 6.0 1.78 50 33 1.0 1380 200
UNITS CIRCUIT V V mA V A A kHz mA %
(XCM517AA) (XCM517AC)
VIN=VEN5.0V, VOUT=VOUT (E)x0.9V VIN=VEN5.0V, VOUT=VOUT (E)x1.1V When connected to external components, (*7) VEN=VIN VOUT (E)+1.2V , IOUT =100mA (*3) VIN=VEN=5.0V, VOUT=0V,ILX =100mA (*3) VIN=VEN=3.6V, VOUT=0V,ILX =100mA (*4) VIN=VEN=5.0V (*4) VIN=VEN=3.6V, VIN=VOUT =5.0V, VEN=0V, LX=0V VIN=VOUT =5.0V, VEN=0V, LX=5.0V (*7) VIN=VEN=5.0V, VOUT=VOUT (E) 0.9V IOUT=30mA -40 Topr 85
100 900 0.65 VSS - 0.1
92 0.35 0.42 0.45 0.52 0.01 0.01 1050 100 -
0 0.55 0.67 0.66 0.77 1.0 1.0 1350 6.0 0.25 0.
% % %
Lx SW "H" ON Resistance 1 RL H Lx SW "H" ON Resistance 2 RL H Lx SW "L" ON Resistance 1 RL L Lx SW "L" ON Resistance 2 RL L (*5) Lx SW "H" Leak Current ILeakH (*5) Lx SW "L" Leak Current ILeakL (*9) Current Limit ILIM Output Voltage VOUT Temperature VOUT topr Characteristics EN "H" Level Voltage EN "L" Level Voltage EN "H" Current EN "L" Current VENH VENL IENH IENL
A A mA ppm/ V V A
VOUT =0V, Applied voltage to VEN, (*10) Voltage changes Lx to "H" level VOUT =0V, Applied voltage to VEN, (*10) Voltage changes Lx to "L" level VIN=VEN=5.0V, VOUT=0V
VIN=5.0V, VEN=0V, VOUT=0V - 0.1 0.1 A When connected to external components, 0.5 1.0 2.5 ms Soft Start Time tSS VEN=0V VIN , IOUT=1mA VIN= VEN=5.0V, VOUT=0.8x VOUT(E), Latch Time tLAT 1.0 20.0 ms (*6) Short Lx at 1 resistance Sweeping VOUT , VIN=VEN= 5.0V, Short Lx at Short Protection VSHORT 1 resistance, VOUT voltage which Lx becomes "L" 0.675 0.900 1.125 V Threshold Voltage level within 1ms Test conditions: Unless otherwise stated, VIN = 5.0V, VOUT (E) = Setting voltage NOTE: *1: Including hysteresis width of operating voltage. *2: EFFI = { ( output voltage output current ) ( input voltage input current) } 100 *3: ON resistance ( )= (VIN - Lx pin measurement voltage) 100mA *4: Design value *5: When temperature is high, a current of approximately 10 A (maximum) may leak. *6: Time until it short-circuits DCOUT with GND via 1 of resistor from an operational state and is set to Lx=0V from current limit pulse generating. *7: When VOUT(E)+1.2V<2.7V, VIN=2.7V *8: When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes. If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance. *9: Current limit denotes the level of detection at peak of coil current. *10: "H" VIN VIN - 1.2V, "L" + 0.1V - 0.1V *11: XCM517xA / XCM517xB series exclude IPFM and MAXIPFM because those are only for the PFM control's functions. *12: The electrical characteristics shows 1 channel values when the other channel is stopped.
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XCM517 Series
ELECTRICAL CHARACTERISTICS (Continued)
XCM517Ax, 1ch Block / 2ch Block
PARAMETER Output Voltage Operating Voltage Range Maximum Output Current UVLO Voltage Supply Current Stand-by Current Oscillation Frequency PFM Switching Current Maximum IPFM Limit Maximum Duty Ratio Minimum Duty Ratio Efficiency
(*2)
VOUT=1.8V, fOSC=3.0MHz, Ta=25
CONDITIONS When connected to external components, VIN=VEN=5.0V, IOUT1=30mA When connected to external components, (*8) VIN=VOUT(E)+2.0V, VEN=1.0V VEN=VIN,VOUT=0V, (*1, *10) Voltage which Lx pin holding "L" level VIN=VEN=5.0V, VOUT=VOUT(E)x1.1V VIN=5.0V, VEN=0V, VOUT=VOUT(E)x1.1V When connected to external components, VIN=VOUT(E)+2.0V,VEN=1.0V, IOUT=100mA When connected to external components, (*11) VIN=VOUT(E)+2.0V, VEN=VIN , IOUT=1mA VEN=VIN=(C-1) IOUT=1mA
(*11)
SYMBOL VOUT VIN IOUTMAX VUVLO IDD ISTB fOSC IPFM MAX IPFM MAXDTY MINDTY EFFI RL H RL H RL L RL L ILeakH ILeakL ILIM VOUT VOUT topr
MIN. 1.764 2.7 600 1.00 2550 170
TYP. 1.800 1.40 46 21 0 3000 220 200
MAX. 1.836 6.0 1.78 65 35 1.0 3450 270 300 0 0.55 0.67 0.66 0.77 1.0 1.0 1350 6.0 0.25 0.
UNITS CIRCUIT V V mA V A A kHz mA % % % %
(XCM517AB) (XCM517AD)
VIN=VEN5.0V, VOUT=VOUT (E)x0.9V VIN=VEN5.0V, VOUT=VOUT (E)x1.1V When connected to external components, (*7) VEN=VIN VOUT (E)+1.2V , IOUT =100mA (*3) VIN=VEN=5.0V, VOUT=0V,ILX =100mA (*3) VIN=VEN=3.6V, VOUT=0V,ILX =100mA (*4) VIN=VEN=5.0V (*4) VIN=VEN=3.6V, VIN=VOUT =5.0V, VEN=0V, LX=0V VIN=VOUT =5.0V, VEN=0V, LX=5.0V (*7) VIN=VEN=5.0V, VOUT=VOUT (E) 0.9V IOUT=30mA -40 Topr 85
100 900 0.65 VSS - 0.1
86 0.35 0.42 0.45 0.52 0.01 0.01 1050 100 -
Lx SW "H" ON Resistance 1 Lx SW "H" ON Resistance 2 Lx SW "L" ON Resistance 1 Lx SW "L" ON Resistance 2 (*5) Lx SW "H" Leak Current (*5) Lx SW "L" Leak Current (*9) Current Limit Output Voltage Temperature Characteristics EN "H" Level Voltage EN "L" Level Voltage EN "H" Current EN "L" Current
A A mA ppm/ V V A
VENH VENL IENH IENL
VOUT =0V, Applied voltage to VEN, (*10) Voltage changes Lx to "H" level VOUT =0V, Applied voltage to VEN, (*10) Voltage changes Lx to "L" level VIN=VEN=5.0V, VOUT=0V
VIN=5.0V, VEN=0V, VOUT=0V - 0.1 0.1 A When connected to external components, 0.5 1.0 2.5 ms Soft Start Time tSS VEN=0V VIN , IOUT=1mA VIN= VEN=5.0V, VOUT=0.8x VOUT(E), Latch Time tLAT 1.0 20.0 ms (*6) Short Lx at 1 resistance Sweeping VOUT , VIN=VEN= 5.0V, Short Lx at Short Protection 0.675 0.900 1.125 V VSHORT 1 resistance, VOUT voltage which Lx becomes "L" Threshold Voltage level within 1ms Test conditions: Unless otherwise stated, VIN = 5.0V, VOUT (E) = Setting voltage NOTE: *1: Including hysteresis width of operating voltage. *2: EFFI = { ( output voltage output current ) ( input voltage input current) } 100 *3: ON resistance ( )= (VIN - Lx pin measurement voltage) 100mA *4: Design value *5: When temperature is high, a current of approximately 10 A (maximum) may leak. *6: Time until it short-circuits DCOUT with GND via 1 of resistor from an operational state and is set to Lx=0V from current limit pulse generating. *7: When VOUT(E)+1.2V<2.7V, VIN=2.7V *8: When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes. If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance. *9: Current limit denotes the level of detection at peak of coil current. *10: "H" VIN VIN - 1.2V, "L" + 0.1V - 0.1V *11: XCM517xA / XCM517xB series exclude IPFM and MAXIPFM because those are only for the PFM control's functions. *12: The electrical characteristics shows 1 channel values when the other channel is stopped.
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XCM517
Series
ELECTRICAL CHARACTERISTICS (Continued)
XCM517Bx, 1ch Block / 2ch Block
PARAMETER Output Voltage Operating Voltage Range Maximum Output Current UVLO Voltage Supply Current Stand-by Current Oscillation Frequency PFM Switching Current Maximum IPFM Limit Maximum Duty Ratio Minimum Duty Ratio Efficiency
(*2)
VOUT=1.8V, fOSC=1.2MHz, Ta=25
CONDITIONS When connected to external components, VIN=VEN=5.0V, IOUT1=30mA When connected to external components, (*8) VIN=VOUT(E)+2.0V, VEN=1.0V VEN=VIN,VOUT=0V, (*1, *10) Voltage which Lx pin holding "L" level VIN=VEN=5.0V, VOUT=VOUT(E)x1.1V VIN=5.0V, VEN=0V, VOUT=VOUT(E)x1.1V When connected to external components, VIN=VOUT(E)+2.0V,VEN=1.0V, IOUT=100mA When connected to external components, (*11) VIN=VOUT(E)+2.0V, VEN=VIN , IOUT=1mA VEN=VIN=(C-1) IOUT=1mA
(*11)
SYMBOL VOUT VIN IOUTMAX VUVLO IDD ISTB fOSC IPFM MAX IPFM MAXDTY MINDTY EFFI RL H RL H RL L RL L ILeakH ILIM VOUT VOUT topr
MIN. 1.764 2.7 600 1.00 1020 120
TYP. 1.800 1.40 22 15 0 1200 160 200
MAX. 1.836 6.0 1.78 50 33 1.0 1380 200
UNITS CIRCUIT V V mA V A A kHz mA %
(XCM517BA) (XCM517BC)
VIN=VEN5.0V, VOUT=VOUT (E)x0.9V VIN=VEN5.0V, VOUT=VOUT (E)x1.1V When connected to external components, (*7) VEN=VIN VOUT (E)+1.2V , IOUT =100mA (*3) VIN=VEN=5.0V, VOUT=0V,ILX =100mA (*3) VIN=VEN=3.6V, VOUT=0V,ILX =100mA (*4) VIN=VEN=5.0V (*4) VIN=VEN=3.6V, VIN=VOUT =5.0V, VEN=0V, LX=0V (*7) VIN=VEN=5.0V, VOUT=VOUT (E) 0.9V IOUT=30mA -40 Topr 85
100 900 0.65 VSS - 0.1 - 0.1 1.0 0.675 200
92 0.35 0.42 0.45 0.52 0.01 1050 100 0.25 0.900 300
0 0.55 0.67 0.66 0.77 1.0 1350 6.0 0.25 0. 0.1 0.4 20.0 1.125 450
% % %
Lx SW "H" ON Resistance 1 Lx SW "H" ON Resistance 2 Lx SW "L" ON Resistance 1 Lx SW "L" ON Resistance 2 (*5) Lx SW "H" Leak Current (*9) Current Limit Output Voltage Temperature Characteristics EN "H" Level Voltage EN "L" Level Voltage EN "H" Current EN "L" Current Soft Start Time Latch Time Short Protection Threshold Voltage Discharge
A mA ppm/ V V A A ms ms V
VENH VENL IENH IENL tSS tLAT VSHORT Rdischg
VOUT =0V, Applied voltage to VEN, (*10) Voltage changes Lx to "H" level VOUT =0V, Applied voltage to VEN, (*10) Voltage changes Lx to "L" level VIN=VEN=5.0V, VOUT=0V VIN=5.0V, VEN=0V, VOUT=0V When connected to external components, VEN=0V VIN , IOUT=1mA VIN= VEN=5.0V, VOUT=0.8x VOUT(E), (*6) Short Lx at 1 resistance Sweeping VOUT , VIN=VEN= 5.0V, Short Lx at 1 resistance, VOUT voltage which Lx becomes "L" level within 1ms VIN = 5.0V LX = 5.0V VEN = 0V VOUT = open
Test conditions: Unless otherwise stated, VIN = 5.0V, VOUT (E) = Setting voltage NOTE: *1: Including hysteresis width of operating voltage. *2: EFFI = { ( output voltage output current ) ( input voltage input current) } 100 *3: ON resistance ( )= (VIN - Lx pin measurement voltage) 100mA *4: Design value *5: When temperature is high, a current of approximately 10 A (maximum) may leak. *6: Time until it short-circuits DCOUT with GND via 1 of resistor from an operational state and is set to Lx=0V from current limit pulse generating. *7: When VOUT(E)+1.2V<2.7V, VIN=2.7V *8: When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes. If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance. *9: Current limit denotes the level of detection at peak of coil current. *10: "H" VIN VIN - 1.2V, "L" + 0.1V - 0.1V *11: XCM517xA / XCM517xB series exclude IPFM and MAXIPFM because those are only for the PFM control's functions. *12: The electrical characteristics shows 1 channel values when the other channel is stopped.
7/28
XCM517 Series
ELECTRICAL CHARACTERISTICS (Continued)
XCM517Bx, 1ch Block /2ch Block
PARAMETER Output Voltage Operating Voltage Range Maximum Output Current UVLO Voltage Supply Current Stand-by Current Oscillation Frequency PFM Switching Current Maximum IPFM Limit Maximum Duty Ratio Minimum Duty Ratio Efficiency
(*2)
VOUT=1.8V, fOSC=3.0MHz, Ta=25
CONDITIONS When connected to external components, VIN=VEN=5.0V, IOUT1=30mA When connected to external components, (*8) VIN=VOUT(E)+2.0V, VEN=1.0V VEN=VIN,VOUT=0V, (*1, *10) Voltage which Lx pin holding "L" level VIN=VEN=5.0V, VOUT=VOUT(E)x1.1V VIN=5.0V, VEN=0V, VOUT=VOUT(E)x1.1V When connected to external components, VIN=VOUT(E)+2.0V,VEN=1.0V, IOUT=100mA When connected to external components, (*11) VIN=VOUT(E)+2.0V, VEN=VIN , IOUT=1mA VEN=VIN=(C-1) IOUT=1mA
(*11)
SYMBOL VOUT VIN IOUTMAX VUVLO IDD ISTB fOSC IPFM MAX IPFM MAXDTY MINDTY EFFI RL H RL H RL L RL L ILeakH ILIM VOUT VOUT topr
MIN. 1.764 2.7 600 1.00 2550 170 100 900 0.65 VSS - 0.1 - 0.1 1.0 0.675 200
TYP. 1.800 1.40 46 21 0 3000 220 200 92 0.35 0.42 0.45 0.52 0.01 1050 100 0.32 0.900 300
MAX. 1.836 6.0 1.78 65 35 1.0 3450 270 300 0 0.55 0.67 0.66 0.77 1.0 1350 6.0 0.25 0. 0.1 0.5 20.0 1.125 450
UNITS CIRCUIT V V mA V A A kHz mA % % % %
(XCM517BB) (XCM517BD)
VIN=VEN5.0V, VOUT=VOUT (E)x0.9V VIN=VEN5.0V, VOUT=VOUT (E)x1.1V When connected to external components, (*7) VEN=VIN VOUT (E)+1.2V , IOUT =100mA (*3) VIN=VEN=5.0V, VOUT=0V,ILX =100mA (*3) VIN=VEN=3.6V, VOUT=0V,ILX =100mA (*4) VIN=VEN=5.0V (*4) VIN=VEN=3.6V, VIN=VOUT =5.0V, VEN=0V, LX=0V (*7) VIN=VEN=5.0V, VOUT=VOUT (E) 0.9V IOUT=30mA -40 Topr 85
Lx SW "H" ON Resistance 1 Lx SW "H" ON Resistance 2 Lx SW "L" ON Resistance 1 Lx SW "L" ON Resistance 2 (*5) Lx SW "H" Leak Current (*9) Current Limit Output Voltage Temperature Characteristics EN "H" Level Voltage EN "L" Level Voltage EN "H" Current EN "L" Current Soft Start Time Latch Time Short Protection Threshold Voltage Discharge
A mA ppm/ V V A A ms ms V
VENH VENL IENH IENL tSS tLAT VSHORT Rdischg
VOUT =0V, Applied voltage to VEN, (*10) Voltage changes Lx to "H" level VOUT =0V, Applied voltage to VEN, (*10) Voltage changes Lx to "L" level VIN=VEN=5.0V, VOUT=0V VIN=5.0V, VEN=0V, VOUT=0V When connected to external components, VEN=0V VIN , IOUT=1mA VIN= VEN=5.0V, VOUT=0.8x VOUT(E), (*6) Short Lx at 1 resistance Sweeping VOUT , VIN=VEN= 5.0V, Short Lx at 1 resistance, VOUT voltage which Lx becomes "L" level within 1ms VIN = 5.0V LX = 5.0V VEN = 0V VOUT = open
Test conditions: Unless otherwise stated, VIN = 5.0V, VOUT (E) = Setting voltage NOTE: *1: Including hysteresis width of operating voltage. *2: EFFI = { ( output voltage output current ) ( input voltage input current) } 100 *3: ON resistance ( )= (VIN - Lx pin measurement voltage) 100mA *4: Design value *5: When temperature is high, a current of approximately 10 A (maximum) may leak. *6: Time until it short-circuits DCOUT with GND via 1 of resistor from an operational state and is set to Lx=0V from current limit pulse generating. *7: When VOUT(E)+1.2V<2.7V, VIN=2.7V *8: When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes. If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance. *9: Current limit denotes the level of detection at peak of coil current. *10: "H" VIN VIN - 1.2V, "L" + 0.1V - 0.1V *11: XCM517xA / XCM517xB series exclude IPFM and MAXIPFM because those are only for the PFM control's functions. *12: The electrical characteristics shows 1 channel values when the other channel is stopped.
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XCM517
Series
ELECTRICAL CHARACTERISTICS (Continued)
PFM Switching Current (IPFM) by Oscillation Frequency and Setting Voltage
(mA) SETTING VOLTAGE VOUT(E) 1.2V 1.2VVOUT(E) 1.75V 1.8VVOUT(E) MIN. 140 130 120 1.2MHz TYP. 180 170 160 MAX. 240 220 200 MIN. 190 180 170 3.0MHz TYP. 260 240 220 MAX. 350 300 270
Input Voltage (VIN) for Measuring Maximum PFM Switching Current (MAXIPFM) Limit
fOSC (C-1) 1.2MHz V OUT(E)+0.5V 3.0MHz V OUT(E)+1.0V
Minimum operating voltage is 2.7V. ex.) Although when V OUT(E) = 1.2V, fOSC = 1.2MHz, (C-1) = 1.7V, the (C-1) becomes 2.7V because of the minimum operating voltage 2.7V.
Soft-start time by each setting voltage PRODUCT SERIES fOSC
XCM517Bx series only SETTING VOLTAGE 0.8 1.5 1.8 2.5 0.8 2.5 0.8 1.8 V OUT(E)<1.5 V OUT(E)<1.8 V OUT(E)<2.5 V OUT(E) 4.0 MIN. TYP. 250 320 250 320 250 320 250 320 MAX. 400 500 400 500 400 500 400 500 s s s s s s s s
1200kHz XC517BA 1200kHz 1200kHz 1200kHz XC517BC XC517BB XC517BD 1200kHz 1200kHz 3000kHz 3000kHz
V OUT(E)<2.5 V OUT(E) 4.0
V OUT(E)<1.8 V OUT(E) 4.0
9/28
XCM517 Series
TYPICAL APPLICATION CIRCUIT
fOSC=3.0MHz L1/L2: 1.5 H (NR3015 TAIYO YUDEN) CIN1/CIN2: 4.7 F (Ceramic) CL1/CL2 : 10 F (Ceramic)
fOSC=1.2MHz L1/L2: 4.7 H (NR4018 TAIYO YUDEN) CIN1/CIN2: 4.7 F (Ceramic) CL1/CL2 : 10 F (Ceramic)
10/28
XCM517
Series
OPERATIONAL DESCRIPTION
The XCM517 series consists of a reference voltage source, ramp wave circuit, error amplifier, PWM comparator, phase compensation circuit, output voltage adjustment resistors, P-channel MOSFET driver transistor, N-channel MOSFET switching transistor for the synchronous switch, current limiter circuit, UVLO circuit and others. (See the block diagram above.) The series ICs compare, using the error amplifier, the voltage of the internal voltage reference source with the feedback voltage from the VOUT pin through split resistors, R1 and R2. Phase compensation is performed on the resulting error amplifier output, to input a signal to the PWM comparator to determine the turn-on time during PWM operation. The PWM comparator compares, in terms of voltage level, the signal from the error amplifier with the ramp wave from the ramp wave circuit, and delivers the resulting output to the buffer driver circuit to cause the Lx pin to output a switching duty cycle. This process is continuously performed to ensure stable output voltage. The current feedback circuit monitors the P-channel MOS driver transistor current for each switching operation, and modulates the error amplifier output signal to provide multiple feedback signals. This enables a stable feedback loop even when a low ESR capacitor such as a ceramic capacitor is used ensuring stable output voltage. The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter. The ramp wave circuit determines switching frequency. The frequency is fixed internally and can be selected from 1.2MHz or 3.0MHz. Clock pulses generated in this circuit are used to produce ramp waveforms needed for PWM operation, and to synchronize all the internal circuits. The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback voltage divided by the internal split resistors, R1 and R2. When a voltage lower than the reference voltage is fed back, the output voltage of the error amplifier increases. The gain and frequency characteristics of the error amplifier output are fixed internally to deliver an optimized signal to the mixer. The current limiter circuit of the XCM517 series monitors the current flowing through the P-channel MOS driver transistor connected to the Lx pin, and features a combination of the current limit mode and the operation suspension mode. When the driver current is greater than a specific level, the current limit function operates to turn off the pulses from the Lx pin at any given timing. When the driver transistor is turned off, the limiter circuit is then released from the current limit detection state. At the next pulse, the driver transistor is turned on. However, the transistor is immediately turned off in the case of an over current state. When the over current state is eliminated, the IC resumes its normal operation. The IC waits for the over current state to end by repeating the steps through . If an over current state continues for a few ms and the above three steps are repeatedly performed, the IC performs the function of latching the OFF state of the driver transistor, and goes into operation suspension mode. Once the IC is in suspension mode, operations can be resumed by either turning the IC off via the EN pin, or by restoring power to the VIN pin. The suspension mode does not mean a complete shutdown, but a state in which pulse output is suspended; therefore, the internal circuitry remains in operation. The current limit of the XCM517 series can be set at 1050mA at typical. Depending on the state of the PC Board, latch time may become longer and latch operation may not work. In order to avoid the effect of noise, the board should be laid out so that input capacitors are placed as close to the IC as possible.
VEN
11/28
XCM517 Series
OPERATIONAL DESCRIPTION (Continued)

The short-circuit protection circuit monitors the internal R1 and R2 divider voltage from the VOUT pin (refer to FB point in the block diagram shown in the previous page). In case where output is accidentally shorted to the Ground and when the FB point voltage decreases less than half of the reference voltage (Vref) and a current more than the ILIM flows to the driver transistor, the short-circuit protection quickly operates to turn off and to latch the driver transistor. In latch mode, the operation can be resumed by either turning the IC off and on via the EN pin, or by restoring power supply to the VIN pin. When sharp load transient happens, a voltage drop at the VOUT is propagated to the FB point through CFB, as a result, short circuit protection may operate in the voltage higher than 1/2 VOUT voltage. < UVLO Circuit> When the VIN pin voltage becomes 1.4V or lower, the P-channel output driver transistor is forced OFF to prevent false pulse output caused by unstable operation of the internal circuitry. When the VIN pin voltage becomes 1.8V or higher, switching operation takes place. By releasing the UVLO function, the IC performs the soft start function to initiate output startup operation. The soft start function operates even when the VIN pin voltage falls momentarily below the UVLO operating voltage. The UVLO circuit does not cause a complete shutdown of the IC, but causes pulse output to be suspended; therefore, the internal circuitry remains in operation. In PFM control operation, until coil current reaches to a specified level (IPFM), the IC keeps the P-ch MOSFET on. In this case, time that the P-ch MOSFET is kept on (tON) can be given by the following formula. tON= L IPFM / (VIN VOUT) IPFM In PFM control operation, the maximum duty ratio (MAXIPFM) is set to 200% (TYP.). Therefore, under the condition that the duty increases (e.g. the condition that the step-down ratio is small), it's possible for P-ch MOSFET to be turned off even when coil current doesn't reach to IPFM. IPFM
IPFM
IPFM
tON Ton
FOSC
M axum um IPFM Current
Lx
Lx
I Lx
IPFM 0mA
I Lx
IPFM 0mA
12/28
XCM517
Series
OPERATIONAL DESCRIPTION (Continued)
CL High Speed Discharge The XCM517Bx series can quickly discharge the electric charge at the output capacitor (CL) when a low signal to the EN pin which enables a whole IC circuit put into OFF state, is inputted via the N-channel transistor located between the LX pin and the VSS pin. When the IC is disabled, electric charge at the output capacitor (CL) is quickly discharged so that it may avoid application malfunction. Discharge time of the output capacitor (CL) is set by the CL auto-discharge resistance (R) and the output capacitor (CL). By setting time constant of a CL auto-discharge resistance value [R] and an output capacitor value (CL) as ( =C x R), discharge time of the output voltage after discharge via the N channel transistor is calculated by the following formulas. V = VOUT(E) x e -t/ , or t=ln (VOUT(E) / V) V : Output voltage after discharge VOUT(E) : Output voltage t: Discharge time, :CxR C= Capacitance of Output capacitor (CL) R= CL auto-discharge resistance
Output Voltage Dischage Characteristics Rdischg = 300 TYP
100 90 80 70 60 50 40 30 20 10 0 0 10 20 30 40 50 60 70 80 90 100 CL=10uF CL=20uF CL=50uF
Discharge Time t (ms)
13/28
XCM517 Series
OPERATIONAL DESCRIPTION (Continued)
The operation of the XCM517 series will enter into the shut down mode when a low level signal is input to the EN pin. During the shutdown mode, the current consumption of the IC becomes 0 A (TYP.), with a state of high impedance at the Lx pin and VOUT pin. The IC starts its operation by inputting a high level signal to the EN pin. The input to the EN pin is a CMOS input and the sink current is 0 A (TYP.).
XCM517 series - Examples of how to use EN pin
(A) SW EN STATUS Stand-by Operation SW_EN SW EN STATUS Operation Stand-by (A) (B) ON OFF EN
ON OFF (B)
SW_EN
EN
Soft Start Soft start time is available in two options via product selection.
The XCM517Ax series provide 1.0ms (TYP). The XCM517Bx series provide 0.25ms (TYP). Soft start time is defined as the time to reach 90% of the output setting voltage when the VEN pin is turned on.
VENH
90% of setting voltage
14/28
XCM517
Series
FUNCTION CHART
EN VOLTAGE LEVEL H Level (*1) OPERATIONAL STATES XCM517xA/XCM517xB Synchronous PWM Fixed Control Stand-by XCM517xC/XCM517xD Synchronous PWM/PFM Automatic Switching Stand-by
L Level (*2)
Note on EN pin voltage level range (*1) H level: 0.65V < H level < VIN (*2) L level: 0V < L level < 0.25V
NOTE ON USE
1. The XCM517 series is designed for use with ceramic output capacitors. If, however, the potential difference is too large between the input voltage and the output voltage, a ceramic capacitor may fail to absorb the resulting high switching energy and oscillation could occur on the output. If the input-output potential difference is large, connect an electrolytic capacitor in parallel to compensate for insufficient capacitance. 2. Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by external component selection, such as the coil inductance, capacitance values, and board layout of external components. Once the design has been completed, verification with actual components should be done. 3. Depending on the input-output voltage differential, or load current, some pulses may be skipped, and the ripple voltage may increase. 4. When the difference between VIN and VOUT is large in PWM control, very narrow pulses will be outputted, and there is the possibility that some cycles may be skipped completely. 5. When the difference between VIN and VOUT is small, and the load current is heavy, very wide pulses will be outputted and there is the possibility that some cycles may be skipped completely. 6. With the IC, the peak current of the coil is controlled by the current limit circuit. Since the peak current increases when dropout voltage or load current is high, current limit starts operation, and this can lead to instability. When peak current becomes high, please adjust the coil inductance value and fully check the circuit operation. In addition, please calculate the peak current according to the following formula: Ipk = (VIN - VOUT) x OnDuty / (2 x L x fOSC) + IOUT L: Coil Inductance Value fOSC: Oscillation Frequency 7. When the peak current which exceeds limit current flows within the specified time, the built-in P-ch driver transistor turns off. During the time until it detects limit current and before the built-in transistor can be turned off, the current for limit current flows; therefore, care must be taken when selecting the rating for the external components such as a coil. 8. Care must be taken when laying out the PC Board, in order to prevent misoperation of the current limit mode. Depending on the state of the PC Board, latch time may become longer and latch operation may not work. In order to avoid the effect of noise, the board should be laid out so that input capacitors are placed as close to the IC as possible. 9. Use of the IC at voltages below the recommended voltage range may lead to instability.
15/28
XCM517 Series
NOTE ON USE (Continued)
10. This IC should be used within the stated absolute maximum ratings in order to prevent damage to the device. 11. When the IC is used in high temperature, output voltage may increase up to input voltage level at no load because of the leak current of the driver transistor. 12. The current limit is set to 1350mA (MAX.) at typical. However, the current of 1350mA or more may flow. In case that the current limit functions while the VOUT pin is shorted to the GND pin, when P-ch MOSFET is ON, the potential difference for input voltage will occur at both ends of a coil. For this, the time rate of coil current becomes large. By contrast, when N-ch MOSFET is ON, there is almost no potential difference at both ends of the coil since the VOUT pin is shorted to the GND pin. Consequently, the time rate of coil current becomes quite small. According to the repetition of this operation, and the delay time of the circuit, coil current will be converged on a certain current value, exceeding the amount of current, which is supposed to be limited originally. Even in this case, however, after the over current state continues for several ms, the circuit will be latched. A coil should be used within the stated absolute maximum rating in order to prevent damage to the device. Current flows into P-ch MOSFET to reach the current limit (ILIM). The current of ILIM or more flows since the delay time of the circuit occurs during from the detection of the current limit to OFF of P-ch MOSFET. Because of no potential difference at both ends of the coil, the time rate of coil current becomes quite small. Lx oscillates very narrow pulses by the current limit for several ms. The circuit is latched, stopping its operation.
# ms
13. In order to stabilize VIN voltage level and oscillation frequency, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the VIN and VSS pins. 14. High step-down ratio and very light load may lead an intermittent oscillation. 15. During PWM / PFM automatic switching mode, operating may become unstable at transition to continuous mode. Please verify with actual parts.
External Components
16/28
XCM517
Series
NOTE ON USE (Continued)
16. Please note the inductance value of the coil. The IC may enter unstable operation if the combination of ambient temperature, setting voltage, oscillation frequency, and L value are not adequate.
In the operation range close to the maximum duty cycle, The IC may happen to enter unstable output voltage operation even if using the L values listed below.

The Range of L Value
fOSC 3.0MHz 1.2MHz VOUT 0.8VVOUT<4.0V VOUT2.5V 2.5VVOUT L Value 1.0H2.2H 3.3H6.8H 4.7H6.8H
*When a coil less value of 4.7 H is used at fOSC=1.2MHz or when a coil less value of 1.5H is used at fOSC=3.0MHz, peak coil current more easily reach the current limit ILMI. In this case, it may happen that the IC can not provide 600mA output current.
17. It may happen to enter unstable operation when the IC operation mode goes into continuous operation mode under the condition of small input-output voltage difference. Care must be taken with the actual design unit.

Instructions of pattern layouts
1. In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the VIN & VSS pins. 2. Please mount each external component as close to the IC as possible. 3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance. 4. Make sure that the PCB GND traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of switching may result in instability of the IC. 5. This series' internal driver transistors bring on heat because of the output current and ON resistance of driver transistors.
17/28
XCM517 Series
TEST CIRCUITS
18/28
XCM517
Series
TYPICAL PERFORMANCE CHARACTERISTICS
(1) Efficiency vs. Output Current VOUT=1.8V,1.2MHz
L=4.7 H(NR4018), CIN=4.7 F, CL=10 F
VOUT=1.8V,3.0MHz
L=1.5 H(NR3015), CIN=4.7 F, CL=10 F
100 90 80 Efficency:EFFI(%)
PWM/PFM Automatic Sw itching Control
100 90 80 Efficency:EFFI(%)
PWM/PFM Automatic Sw itching Control
70 60 50 40 30 20 10 0 0.1
VIN= 4.2V 3.6V PWM Control VIN= 4.2V 3.6V
70 60 50 40 30 20 10 0
VIN= 4.2V 3.6V PWM Control VIN= 4.2V 3.6V
1
10
100
1000
0.1
1
10
100
1000
Output Current:IOUT(mA)
Output Current:IOUT(mA)
(2) Output Voltage vs. Output Current VOUT=1.8V,1.2MHz
L=4.7 H(NR4018), CIN=4.7 F, CL=10 F
VOUT=1.8V,3.0MHz
L=1.5 H(NR3015), CIN=4.7 F, CL=10 F
2.1 2.0 Output Voltage:Vout(V) 1.9 1.8 1.7 PWM Control 1.6 1.5 0.1 1 10 100 1000 Output Current:IOUT(mA) PWM/PFM Automatic Sw itching Control VIN4.2V,3.6V Output Voltage:Vout(V)
2.1 2.0 1.9 1.8 1.7 1.6 1.5 0.1 1 10 100 1000 Output Current:IOUT(mA) PWM/PFM Automatic Sw itching Control VIN4.2V,3.6V
PWM Control
(3) Ripple Voltage vs. Output Current VOUT=1.8V,1.2MHz
L=4.7 H(NR4018), CIN=4.7 F, CL=10 F
VOUT=1.8V,3.0MHz
L=1.5 H(NR3015), CIN=4.7 F, CL=10 F
100
100
80 Ripple Voltage:Vr(mV) Ripple Voltage:Vr(mV)
80
60 PWM Control VIN4.2V,3.6V
40
PWM/PFM Automatic Sw itching Control VIN4.2V 3.6V
60
PWM Control VIN4.2V,3.6V
40
PWM/PFM Automatic Sw itching Control VIN4.2V 3.6V
20
20
0 0.1 1 10 100 1000 Output Current:IOUT(mA)
0 0.1 1 10 100 1000 Output Current:IOUT(mA)
19/28
XCM517 Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(4) Oscillation Frequency vs. Ambient Temperature VOUT=1.8V,1.2MHz
L=4.7 H(NR4018), CIN=4.7 F, CL=10 F
VOUT=1.8V,3.0MHz
L=1.5 H(NR3015), CIN=4.7 F, CL=10 F
1.5 Oscillation Frequency : FOSC(MHz) Oscillation Frequency : FOSC(MHz) 1.4 1.3 1.2 1.1 1.0 0.9 0.8 -50 -25 0 25 50 75 100 VIN=3.6V
3.5 3.4 3.3 3.2 3.1 3.0 2.9 2.8 2.7 2.6 2.5 -50 -25 0 25 50 75 100 Ambient Temperature: Ta () Ambient Temperature: Ta () VIN=3.6V
(5) Supply Current vs. Ambient Temperature VOUT=1.8V,1.2MHz
40 35 Supply Current : IDD (A) 30 25 20 15 10 5 0 -50 VIN=4.0V Supply Current : IDD (A) VIN=6.0V 40 35 30 25 20 15 10 5 0 -50
VOUT=1.8V,3.0MHz
VIN=6.0V VIN=4.0V
-25
0
25
50
75
100
-25
0
25
50
75
100
Ambient Temperature: Ta ( )
Ambient Temperature: Ta ()
(6) Output Voltage vs. Ambient Temperature VOUT=1.8V,3.0MHz
2.1 2.0 1.9 1.8 1.7 1.6 1.5 -50 -25 0 25 50 75 100 Ambient Temperature: Ta () UVLO Voltage : UVLO (V) 1.8 1.5 1.2 0.9 0.6 0.3 0.0
(7) UVLO Voltage vs. Ambient Temperature VOUT=1.8V,3.0MHz
EN=VIN EN=VIN CE=VIN
Output Voltage : VOUT (V)
VIN=3.6V
-50
-25
0
25
50
75
100
Ambient Temperature: Ta ()
20/28
XCM517
Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(8) CE "H" Voltage vs. Ambient Temperature VOUT=1.8V,3.0MHz
1.0 CE "H" Voltage : VCEH (V) 0.9 CE "L" Voltage : VCEL (V) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -50 -25 0 25 50 75 100 Ambient Temperature: Ta ( ) VIN=3.6V VIN=5.0V 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -50 -25 0 25 50 75 100 Ambient Temperature: Ta () VIN=3.6V VIN=5.0V
(9) CE "L" Voltage vs. Ambient Temperature VOUT=1.8V,3.0MHz
(10) Soft Start Time vs. Ambient Temperature VOUT=1.8V,3.0MHz
L=4.7 H(NR4018), CIN=4.7 F, CL=10 F
VOUT=1.8V,3.0MHz
L=1.5 H(NR3015), CIN=4.7 F, CL=10 F
5
5
Soft Start Time : TSS (ms)
3
Soft Start Time : TSS (ms)
4
4
3
2
VIN=3.6V
2
VIN=3.6V
1
1
0 -50
-25
0
25
50
75
100
0 -50
-25
0
25
50
75
100
Ambient Temperature: Ta ()
Ambient Temperature: Ta ()
(11) "Pch / Nch" Driver on Resistance vs. Input Voltage VOUT=1.8V,3.0MHz
Lx SW ON Resistance:RLxH,RLxL () 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 1 2 3 4 5 6 Input Voltage : VIN (V) Pch on Resistance Nch on Resistance
21/28
XCM517 Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(12) XCM517BxSeries Rise Wave Form VOUT=1.2V,1.2MHz
L=4.7 H (NR4018), CIN=4.7 F, CL=10 F
VOUT=3.3V,3.0MHz
L=1.5 H (NR3015), CIN=4.7 F, CL=10 F
VIN=5.0V IOUT=1.0mA
VIN=5.0V IOUT=1.0mA
VOUT
0.5V/div
VOUT
1.0V/div
EN
0.0V 1.0V
EN
0.0V 1.0V
100 s/div
100 s/div
(13) XCM517BxSeries Soft-Start Time vs. Ambient Temperature VOUT=1.2V,1.2MHz
L=4.7 H(NR4018), CIN=4.7 F, CL=10 F
VOUT=3.3V,3.0MHz
L=1.5 H(NR3015), CIN=4.7 F, CL=10 F
500
500
Soft Start Time :TSS (s)
Soft Start Time :TSS (s)
400
400
300
300
200 VIN=5.0V IOUT=1.0mA
200 VIN=5.0V IOUT=1.0mA
100
100
0 -50 -25 0 25 50 75 100
0 -50 -25 0 25 50 75 100
Ambient Temperature: Ta()
Ambient Temperature: Ta()
(14) XCM517BxSeries CL Discharge Resistance vs. Ambient Temperature VOUT=3.3V,3.0MHz
600 VIN=6.0V VIN=4.0V 400
CL Discharge Resistance: ( )
500
300
200
100 -50
-25
0
25
50
75
100
Ambient Temperature: Ta ()
22/28
XCM517
Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) Load Transient Response VOUT=1.2V, 1.2MHz (PWM/PFM Automatic Switching Control) L=4.7 H(NR4018), CIN=4.7 VIN=3.6V, EN=VIN
IOUT=1mA 100mA IOUT =1mA 300mA
F(ceramic), CL=10 F(ceramic), Topr=25
1ch : IOUT
1ch : IOUT
2ch VOUT : 50mV/div
2ch VOUT : 50mV/div
50
s/div
50
s/div
IOUT=100mA
1mA
IOUT=300mA
1mA
1ch : IOUT
1ch : IOUT
2ch VOUT: 50mV/div 200 s/div
2ch VOUT: 50mV/div 200 s/div
23/28
XCM517 Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) Load Transient Response (Continued) VOUT=1.2V, 1.2MHz (PWM Control) L=4.7 H(NR4018), CIN=4.7 VIN=3.6V, EN=VIN
IOUT=1mA 100mA IOUT=1mA 300mA
F(ceramic), CL=10 F(ceramic), Topr=25
1ch: IOUT
1ch: IOUT
2ch VOUT : 50mV/div
2ch VOUT: 50mV/div
50
s/div
50
s/div
IOUT=100mA
1mA
IOUT=300mA
1mA
1ch: IOUT
1ch: IOUT
2ch VOUT : 50mV/div
2ch VOUT : 50mV/div
200
s/div
200
s/div
24/28
XCM517
Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) Load Transient Response (Continued) VOUT=1.8V, 3.0MHz (PWM/PFM Automatic Switching Control) L=1.5 H(NR3015), CIN=4.7 VIN=3.6V, EN=VIN
IOUT=1mA 100mA IOUT=1mA 300mA
F(ceramic), CL=10 F(ceramic),Topr=25
1ch : IOUT
1ch : IOUT
2ch VOUT : 50mV/div
2ch VOUT : 50mV/div
50
s/div
50
s/div
IOUT=100mA
1mA
IOUT=300mA
1mA
1ch : IOUT
1ch : IOUT
2ch VOUT : 50mV/div
2ch VOUT : 50mV/div
200
s/div
200
s/div
25/28
XCM517 Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) Load Transient Response (Continued) VOUT=1.8V, 3.0MHz (PWM Control) L=1.5 H(NR3015), CIN=4.7 VIN=3.6V, EN=VIN
IOUT=1mA 100mA IOUT=1mA 300mA
F(ceramic), CL=10 F(ceramic), Topr=25
1ch : IOUT
1ch : IOUT
2ch VOUT : 50mV/div
2ch VOUT : 50mV/div
50
s/div
50
s/div
IOUT=100mA
1mA
IOUT=300mA
1mA
1ch : IOUT
1ch : IOUT
2ch VOUT : 50mV/div
2ch VOUT : 50mV/div
200
s/div
200
s/div
26/28
XCM517
Series
PACKAGING INFORMATION
USP-12B01
2 .80 .08
2 .30 .08
1234 567 8
MAX 0 . 6
(0 .4 ) (0 .4 ) (0 .4 ) (0 .4 ) (0 .4 )
(0 .25 ) (0 .15 )
0 .25 .05 0 0 .2 .05 0 0 .2 .05 0 0 .2 .05 0 0 .2 .05 0 0 .2 .05 0 0 .250 .1
1
2
3
4
5
6
1 .30 .1
0 .40 .1
* Au plate thickness: Minimum 0.3
m
Au m in0 .3u m
*The side of pins is not plated, nickel is exposed.
0 .250 .1
12 11 10 9
1 .20 .1
0 .70 .05
8
7
1 .20 .1
0 .70 .05
is than Au other pins. *Pin #1 wider 1
20/1 mm UNIT: mm
USP-12B01 Reference Pattern Layout
1 .35 1 .35 0 .45 0 .90 0 .90 0 .45 0 .65 0 .65 0 .25 0 .25 1 .05 0 .95 0 .65 0 .55 0 .25 0 .15 0 .25 0 .30 0 .025 0 .025 0 .025 0 .025
USP-12B01 Reference Metal Mask Design
0 .35 1 .30 1 .30 0 .95 0 .95 0 .55 0 .55 0 .25 0 .25 0 .35
1 .05 0 .95 0 .65 0 .55 0 .25 0 .15 0 .05 0 .15 0 .05 0 .05 0 .20 0 .05
0 .10 0 .10
1 .30 1 .60
0 .20
0 .50
0 .20
0 .15
0 .40
0 .15
0 .60 1 .10 1 .55
0 .60 1 .10 1 .55
1 .30 1 .60
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XCM517 Series
1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD.
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